| |
| 2001 | ||
|---|---|---|
| 3 | EE | Y. C. Chan, P. L. Tu, K. C. Hung: Study of the self-alignment of no-flow underfill for micro-BGA assembly. Microelectronics Reliability 41(11): 1867-1875 (2001) |
| 2 | EE | P. L. Tu, Y. C. Chan, K. C. Hung: Reliability of microBGA assembly using no-flow underfill. Microelectronics Reliability 41(12): 1993-2000 (2001) |
| 1 | EE | P. L. Tu, Y. C. Chan, K. C. Hung, J. K. L. Lai: Study of micro-BGA solder joint reliability. Microelectronics Reliability 41(2): 287-293 (2001) |
| 1 | Y. C. Chan | [1] [2] [3] |
| 2 | K. C. Hung | [1] [2] [3] |
| 3 | J. K. L. Lai | [1] |