J. K. L. Lai
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2001
1
EE
P. L. Tu
,
Y. C. Chan
,
K. C. Hung
, J. K. L. Lai: Study of micro-BGA solder joint reliability.
Microelectronics Reliability 41
(2): 287-293 (2001)
Coauthor
Index
1
Y. C. Chan
[
1
]
2
K. C. Hung
[
1
]
3
P. L. Tu
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
