7. SLIP 2005: San Francisco, CA, USA

Interconnect scaling

• Ron Ho:
  High-performance ULSI: the real limiter to interconnect scaling. 3
  Electronic Edition (ACM DL) BibTeX

Interconnect optimization

• Takumi Uezono, Junpei Inoue, Takanori Kyogoku, Kenichi Okada, Kazuya Masu:
  Prediction of delay time for future LSI using on-chip transmission line interconnects. 7-12
  Electronic Edition (ACM DL) BibTeX
• Guoqing Chen, Hui Chen, Mikhail Haurylau, Nicholas Nelson, Philippe M. Fauchet, Eby G. Friedman, David H. Albonesi:
  Predictions of CMOS compatible on-chip optical interconnect. 13-20
  Electronic Edition (ACM DL) BibTeX
• J. Balachandran, Steven Brebels, G. Carchon, T. Webers, Walter De Raedt, Bart Nauwelaers, Eric Beyne:
  Package level interconnect options. 21-27
  Electronic Edition (ACM DL) BibTeX
• Katherine Shu-Min Li, Chung-Len Lee, Yao-Wen Chang, Chauchin Su, Jwu E. Chen:
  Multilevel full-chip routing with testability and yield enhancement. 29-36
  Electronic Edition (ACM DL) BibTeX

Interconnect variation

• N. S. Nagaraj:
  Dealing with interconnect process variations. 39
  Electronic Edition (ACM DL) BibTeX

Interconnect prediction

• Mary Yvonne Lanzerotti, Giovanni Fiorenza, Rick A. Rand:
  Predicting interconnect requirements in ultra-large-scale integrated control logic circuitry. 43-50
  Electronic Edition (ACM DL) BibTeX
• Wim Heirman, Joni Dambre, Christof Debaes, Hugo Thienpont, Dirk Stroobandt, Jan Van Campenhout:
  Prediction model for evaluation of reconfigurable interconnects in distributed shared-memory systems. 51-58
  Electronic Edition (ACM DL) BibTeX

Power and noise

• David J. Hathaway:
  Dealing with the spatio-temporal interactions among transient power, supply noise and timing. 61
  Electronic Edition (ACM DL) BibTeX

Interconnect in three dimensions

• Young-Su Kwon, Payam Lajevardi, Anantha P. Chandrakasan, Frank Honoré, Donald E. Troxel:
  A 3-D FPGA wire resource prediction model validated using a 3-D placement and routing tool. 65-72
  Electronic Edition (ACM DL) BibTeX
• Viet H. Nguyen, Phillip Christie:
  The impact of interstratal interconnect density on the performance of three-dimensional integrated circuits. 73-78
  Electronic Edition (ACM DL) BibTeX

Design issues for interconnect

• Jens Lienig:
  Interconnect and current density stress: an introduction to electromigration-aware design. 81-88
  Electronic Edition (ACM DL) BibTeX

nterconnect congestion estimation

• Chiu-Wing Sham, Evangeline F. Y. Young:
  Congestion prediction in early stages. 91-98
  Electronic Edition (ACM DL) BibTeX
• Jurjen Westra, Patrick Groeneveld:
  Is probabilistic congestion estimation worthwhile? 99-106
  Electronic Edition (ACM DL) BibTeX