| 2007 |
|---|
| 10 | EE | Syed M. Alam,
Chee Lip Gan,
Carl V. Thompson,
Donald E. Troxel:
Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations.
Microelectronics Journal 38(4-5): 463-473 (2007) |
| 2005 |
|---|
| 9 | EE | Syed M. Alam,
Donald E. Troxel,
Carl V. Thompson:
Thermal aware cell-based full-chip electromigration reliability analysis.
ACM Great Lakes Symposium on VLSI 2005: 26-31 |
| 8 | EE | Syed M. Alam,
Frank L. Wei,
Chee Lip Gan,
Carl V. Thompson,
Donald E. Troxel:
Electromigration Reliability Comparison of Cu and Al Interconnects.
ISQED 2005: 303-308 |
| 7 | EE | Young-Su Kwon,
Payam Lajevardi,
Anantha P. Chandrakasan,
Frank Honoré,
Donald E. Troxel:
A 3-D FPGA wire resource prediction model validated using a 3-D placement and routing tool.
SLIP 2005: 65-72 |
| 2004 |
|---|
| 6 | EE | Syed M. Alam,
Chee Lip Gan,
Carl V. Thompson,
Donald E. Troxel:
Circuit Level Reliability Analysis of Cu Interconnects.
ISQED 2004: 238-243 |
| 2003 |
|---|
| 5 | EE | Wonjoon Cho,
Emanuel M. Sachs,
Nicholas M. Patrikalakis,
Donald E. Troxel:
A dithering algorithm for local composition control with three-dimensional printing.
Computer-Aided Design 35(9): 851-867 (2003) |
| 2002 |
|---|
| 4 | EE | Syed M. Alam,
Donald E. Troxel,
Carl V. Thompson:
A Comprehensive Layout Methodology and Layout-Specific Circuit Analyses for Three-Dimensional Integrated Circuits.
ISQED 2002: 246-251 |
| 1984 |
|---|
| 3 | EE | Samuel M. Goldwasser,
Donald E. Troxel:
Page composition of continuous tone imagery.
Computer Vision, Graphics, and Image Processing 26(1): 30-44 (1984) |
| 1983 |
|---|
| 2 | | Samuel M. Goldwasser,
Donald E. Troxel:
Page composition of continuous tone imagery.
Computer Vision, Graphics, and Image Processing 22(1): 204 (1983) |
| 1975 |
|---|
| 1 | | Donald E. Troxel:
Serial Interfaces for Minicomputers.
IEEE Trans. Computers 24(10): 1027-1028 (1975) |
