| |
| 1995 | ||
|---|---|---|
| 1 | Chao-Kun Hu, Kenneth P. Rodbell, Timothy D. Sullivan, Kim Y. Lee, Dennis P. Bouldin: Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines. IBM Journal of Research and Development 39(4): 465-498 (1995) | |
| 1 | Chao-Kun Hu | [1] |
| 2 | Kim Y. Lee | [1] |
| 3 | Kenneth P. Rodbell | [1] |
| 4 | Timothy D. Sullivan | [1] |