Volume 37,
Number 1,
1993
Volume 37,
Number 2,
1993
- Jean Horkans:
Preface.
83-84 BibTeX
- Hariklia Deligianni, Lubomyr T. Romankiw:
In situ surface pH measurement during electrolysis using a rotating pH electrode.
85-96 BibTeX
- Jean Horkans, I.-Chia Hsu Chang, Panayotis C. Andricacos:
A rotating ring-disk stripping technique used to study electroplating of Sn-Pb from methane sulfonic acid solutions.
97-106 BibTeX
- John G. Gaudiello, Gerald L. Ballard:
Mechanistic insights into metal-mediated electroless copper plating employing hypophosphite as a reducing agent.
107-116 BibTeX
- Rangarajan Jagannathan, Mahadevaiyer Krishnan:
Electroless plating of copper at a low pH level.
117-124 BibTeX
- John O. Dukovic:
Feature-scale simulation of resist-patterned electrodeposition.
125-142 BibTeX
- Oscar A. Moreno, Robert H. Katyl, Jeffrey D. Jones, Peter A. Moschak:
Mass transfer of an impinging jet confined between parallel plates.
143-156 BibTeX
- Kay Keij Kanazawa, Owen R. Melroy:
The quartz resonator: Electrochemical applications.
157-172 BibTeX
- Vlasta Brusic, Gerald S. Frankel, Chao-Kyn Hu, Miro M. Plechaty, Geraldine Cogin Schwartz:
Corrosion and protection of thin-line conductors in VLSI structures.
173-190 BibTeX
- Alejandro G. Schrott, Gerald S. Frankel:
Application of X-ray spectroscopy to the study of electrochemically formed surface oxide films.
191-206 BibTeX
- Madhav Datta:
Anodic dissolution of metals at high rates.
207-226 BibTeX
- Hajime Seki:
In situ infrared spectroscopy of the electrode - electrolyte interface.
227-242 BibTeX
- James R. White:
Conduction mechanisms in contaminant layers on printed circuit boards.
243-248 BibTeX
- Arthur F. Diaz, Jean Guay:
Contact charging of organic materials: Ion vs. electron transfer.
249-260 BibTeX
Volume 37,
Number 3,
1993
- John M. Warlaumont:
Preface.
288-290 BibTeX
- Eberhard Spiller:
Early history of X-ray lithography at IBM.
291-298 BibTeX
- Alan D. Wilson:
X-ray lithography in IBM, 1980-1992, the development years.
299-318 BibTeX
- Henry I. Smith, Mark L. Schattenburg:
X-ray lithography from 500 to 30 nm: X-ray nanolithography.
319-330 BibTeX
- Jerry Z. Y. Guo, Franco Cerrina:
Modeling X-ray proximity lithography.
331-350 BibTeX
- Martin N. Wilson, Ailstair I. C. Smith, V. C. Kempson, Martin C. Townsend, Joseph C. Schouten, Robert J. Anderson, A. R. Jorden, Victor P. Suller, Michael W. Poole:
The Helios 1 compact superconducting storage ring X-ray source.
351-372 BibTeX
- Chas Archie:
Performance of the IBM synchrotron X-ray source for lithography.
373-384 BibTeX
- Jeffrey A. Leavey, L. Grant Lesoine:
Design considerations for the IBM X-ray lithography facility.
385-394 BibTeX
- Jerome P. Silverman, Robert P. Rippstein, James M. Oberschmidt:
X-ray lithography beamlines in the IBM Advanced Lithography Facility.
395-410 BibTeX
- Timothy R. Groves, John G. Hartley, Hans C. Pfeiffer, Denise Puisto, Donald K. Bailey:
Electron beam lithography tool for manufacture of X-ray masks.
411-420 BibTeX
- Patricia G. Blauner, John Mauer:
X-ray mask repair.
421-434 BibTeX
- David Seeger:
Resist materials and processes for X-ray lithography.
435-448 BibTeX
Volume 37,
Number 4,
1993
Volume 37,
Number 5,
1993
- Chun K. Lim, Thomas Caulfield, Joseph Benenati:
Preface.
582-584 BibTeX
- John S. Corbin:
Finite element analysis for Solder Ball Connect (SBC) structural design optimization.
585-596 BibTeX
- Michael D. Ries, Donald R. Banks, David P. Watson, Karl G. Hoebener:
Attachment of Solder Ball Connect (SBC) packages to circuit cards.
597-608 BibTeX
- H. Victor Mahaney:
Thermal modeling of the infrared reflow process for Solder Ball Connect (SBC).
609-620 BibTeX
- Tien Y. Wu, Yifan Guo, William T. Chen:
Thermal-mechanical strain characterization for printed wiring boards.
621-634 BibTeX
- Yifan Guo, Chun K. Lim, William T. Chen, Charles G. Woychik:
Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation.
635-648 BibTeX
- Hyung-Chu Choi, Yifan Guo, William LaFontaine, Chun K. Lim:
Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain analysis via image processing, and reliability considerations.
649-660 BibTeX
Volume 37,
Number 6,
1993
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Copyright © Sun May 17 00:00:10 2009
by Michael Ley (ley@uni-trier.de)