2004 |
4 | EE | Juan C. Parrilla,
Frank E. Bosco,
John S. Corbin,
John J. Loparco,
Prabjit Singh,
John G. Torok:
Packaging the IBM eServer z990 central electronic complex.
IBM Journal of Research and Development 48(3-4): 395-408 (2004) |
2002 |
3 | EE | John S. Corbin,
Ciro N. Ramirez,
Danny E. Massey:
Land grid array sockets for server applications.
IBM Journal of Research and Development 46(6): 763-778 (2002) |
2001 |
2 | EE | Budy D. Notohardjono,
John S. Corbin,
Steven J. Mazzuca,
Steven C. McIntosh,
Howard Welz:
Modular server frame with robust earthquake retention.
IBM Journal of Research and Development 45(6): 771-782 (2001) |
1993 |
1 | | John S. Corbin:
Finite element analysis for Solder Ball Connect (SBC) structural design optimization.
IBM Journal of Research and Development 37(5): 585-596 (1993) |