Hyung-Chu Choi

List of publications from the DBLP Bibliography Server - FAQ

1993

1 Hyung-Chu Choi, Yifan Guo, William LaFontaine, Chun K. Lim: Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain analysis via image processing, and reliability considerations. IBM Journal of Research and Development 37(5): 649-660 (1993)

1993
1		Hyung-Chu Choi, Yifan Guo, William LaFontaine, Chun K. Lim: Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain analysis via image processing, and reliability considerations. IBM Journal of Research and Development 37(5): 649-660 (1993)

Coauthor Index