Charles G. Woychik

List of publications from the DBLP Bibliography Server - FAQ

1993

1 Yifan Guo, Chun K. Lim, William T. Chen, Charles G. Woychik: Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation. IBM Journal of Research and Development 37(5): 635-648 (1993)

1993
1		Yifan Guo, Chun K. Lim, William T. Chen, Charles G. Woychik: Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation. IBM Journal of Research and Development 37(5): 635-648 (1993)

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