| 1993 |
|---|
| 3 | | Tien Y. Wu,
Yifan Guo,
William T. Chen:
Thermal-mechanical strain characterization for printed wiring boards.
IBM Journal of Research and Development 37(5): 621-634 (1993) |
| 2 | | Yifan Guo,
Chun K. Lim,
William T. Chen,
Charles G. Woychik:
Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation.
IBM Journal of Research and Development 37(5): 635-648 (1993) |
| 1 | | Hyung-Chu Choi,
Yifan Guo,
William LaFontaine,
Chun K. Lim:
Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain analysis via image processing, and reliability considerations.
IBM Journal of Research and Development 37(5): 649-660 (1993) |
