Tien Y. Wu
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1993
1
Tien Y. Wu,
Yifan Guo
,
William T. Chen
: Thermal-mechanical strain characterization for printed wiring boards.
IBM Journal of Research and Development 37
(5): 621-634 (1993)
Coauthor
Index
1
William T. Chen
[
1
]
2
Yifan Guo
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
