| |
| 1993 | ||
|---|---|---|
| 2 | Tien Y. Wu, Yifan Guo, William T. Chen: Thermal-mechanical strain characterization for printed wiring boards. IBM Journal of Research and Development 37(5): 621-634 (1993) | |
| 1 | Yifan Guo, Chun K. Lim, William T. Chen, Charles G. Woychik: Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation. IBM Journal of Research and Development 37(5): 635-648 (1993) | |
| 1 | Yifan Guo | [1] [2] |
| 2 | Chun K. Lim | [1] |
| 3 | Charles G. Woychik | [1] |
| 4 | Tien Y. Wu | [2] |