| |
| 1993 | ||
|---|---|---|
| 1 | Hyung-Chu Choi, Yifan Guo, William LaFontaine, Chun K. Lim: Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain analysis via image processing, and reliability considerations. IBM Journal of Research and Development 37(5): 649-660 (1993) | |
| 1 | Hyung-Chu Choi | [1] |
| 2 | Yifan Guo | [1] |
| 3 | Chun K. Lim | [1] |