| 2008 |
|---|
| 7 | EE | Wilfried Haensch:
Why should we do 3D integration?
DAC 2008: 674-675 |
| 2007 |
|---|
| 6 | EE | Kerry Bernstein,
Paul Andry,
Jerome Cann,
Philip G. Emma,
David Greenberg,
Wilfried Haensch,
Mike Ignatowski,
Steve Koester,
John Magerlein,
Ruchir Puri,
Albert M. Young:
Interconnects in the Third Dimension: Design Challenges for 3D ICs.
DAC 2007: 562-567 |
| 2006 |
|---|
| 5 | EE | Wilfried Haensch,
Mei-Kei Ieong:
Preface.
IBM Journal of Research and Development 50(4-5): 337-338 (2006) |
| 4 | EE | Wilfried Haensch,
Edward J. Nowak,
Robert H. Dennard,
Paul M. Solomon,
Andres Bryant,
Omer H. Dokumaci,
Arvind Kumar,
Xinlin Wang,
Jeffrey B. Johnson,
Massimo V. Fischetti:
Silicon CMOS devices beyond scaling.
IBM Journal of Research and Development 50(4-5): 339-362 (2006) |
| 3 | EE | David J. Frank,
Wilfried Haensch,
Ghavam Shahidi,
Omer H. Dokumaci:
Optimizing CMOS technology for maximum performance.
IBM Journal of Research and Development 50(4-5): 419-432 (2006) |
| 2 | EE | Kerry Bernstein,
David J. Frank,
Anne E. Gattiker,
Wilfried Haensch,
Brian L. Ji,
Sani R. Nassif,
Edward J. Nowak,
Dale J. Pearson,
Norman J. Rohrer:
High-performance CMOS variability in the 65-nm regime and beyond.
IBM Journal of Research and Development 50(4-5): 433-450 (2006) |
| 1 | EE | Scott Hanson,
Bo Zhai,
Kerry Bernstein,
David Blaauw,
Andres Bryant,
Leland Chang,
Koushik K. Das,
Wilfried Haensch,
Edward J. Nowak,
Dennis Sylvester:
Ultralow-voltage, minimum-energy CMOS.
IBM Journal of Research and Development 50(4-5): 469-490 (2006) |
