Mike Ignatowski

2008
2	EE	Syed M. Alam, Mike Ignatowski, Yuan Xie: Technology, CAD tools, and designs for emerging 3D integration technology. ACM Great Lakes Symposium on VLSI 2008: 1-2
2007
1	EE	Kerry Bernstein, Paul Andry, Jerome Cann, Philip G. Emma, David Greenberg, Wilfried Haensch, Mike Ignatowski, Steve Koester, John Magerlein, Ruchir Puri, Albert M. Young: Interconnects in the Third Dimension: Design Challenges for 3D ICs. DAC 2007: 562-567

Coauthor Index

1	Syed M. Alam	[2]
2	Paul Andry	[1]
3	Kerry Bernstein	[1]
4	Jerome Cann	[1]
5	Philip G. Emma	[1]
6	David Greenberg	[1]
7	Wilfried Haensch	[1]
8	Steve Koester	[1]
9	John Magerlein	[1]
10	Ruchir Puri	[1]
11	Yuan Xie	[2]
12	Albert M. Young	[1]