2007 | ||
---|---|---|
2 | EE | Kerry Bernstein, Paul Andry, Jerome Cann, Philip G. Emma, David Greenberg, Wilfried Haensch, Mike Ignatowski, Steve Koester, John Magerlein, Ruchir Puri, Albert M. Young: Interconnects in the Third Dimension: Design Challenges for 3D ICs. DAC 2007: 562-567 |
2006 | ||
1 | EE | Anna W. Topol, Douglas C. La Tulipe Jr., Leathen Shi, David J. Frank, Kerry Bernstein, Steven E. Steen, Arvind Kumar, Gilbert U. Singco, Albert M. Young, Kathryn W. Guarini, Mei-Kei Ieong: Three-dimensional integrated circuits. IBM Journal of Research and Development 50(4-5): 491-506 (2006) |
1 | Paul Andry | [2] |
2 | Kerry Bernstein | [1] [2] |
3 | Jerome Cann | [2] |
4 | Philip G. Emma | [2] |
5 | David J. Frank | [1] |
6 | David Greenberg | [2] |
7 | Kathryn W. Guarini | [1] |
8 | Wilfried Haensch | [2] |
9 | Mei-Kei Ieong | [1] |
10 | Mike Ignatowski | [2] |
11 | Steve Koester | [2] |
12 | Arvind Kumar | [1] |
13 | John Magerlein | [2] |
14 | Ruchir Puri | [2] |
15 | Leathen Shi | [1] |
16 | Gilbert U. Singco | [1] |
17 | Steven E. Steen | [1] |
18 | Anna W. Topol | [1] |
19 | Douglas C. La Tulipe Jr. | [1] |