Volume 4,
Number 1,
March 2008
Volume 4,
Number 2,
April 2008
- Vijaykrishnan Narayanan:
Editorial.
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- R. Iris Bahar, Krishnendu Chakrabarty:
Introduction to joint ACM JETC/TODAES special issue on new, emerging, and specialized technologies.
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- Shih-Hsien Kuo, Bruce Tidor, Jacob White:
A meshless, spectrally accurate, integral equation solver for molecular surface electrostatics.
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- Jie Deng, Albert Lin, Gordon C. Wan, H.-S. Philip Wong:
Carbon nanotube transistor compact model for circuit design and performance optimization.
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- Josep Carmona, Jordi Cortadella, Yousuke Takada, Ferdinand Peper:
Formal methods for the analysis and synthesis of nanometer-scale cellular arrays.
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- Michael Crocker, Michael T. Niemier, Xiaobo Sharon Hu, Marya Lieberman:
Molecular QCA design with chemically reasonable constraints.
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Volume 4,
Number 3,
August 2008
- Alvin R. Lebeck, Krishnendu Chakrabarty:
Introduction to DAC 2007 special section.
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- Tao Xu, Krishnendu Chakrabarty:
Integrated droplet routing and defect tolerance in the synthesis of digital microfluidic biochips.
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- Tsung-Ching Huang, Kwang-Ting (Tim) Cheng, Huai-Yuan Tseng, Chen-Pang Kung:
Reliability analysis for flexible electronics: Case study of integrated a-Si: H TFT scan driver.
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- Jing Li, Aditya Bansal, Swaroop Ghosh, Kaushik Roy:
An alternate design paradigm for low-power, low-cost, testable hybrid systems using scaled LTPS TFTs.
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- Reza M. Rad, Mohammad Tehranipoor:
SCT: A novel approach for testing and configuring nanoscale devices.
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Volume 4,
Number 4,
October 2008
- Yuan Xie, Jason Cong, Paul Franzon:
Editorial: Special issue on 3D integrated circuits and microarchitectures.
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- Taeho Kgil, Ali G. Saidi, Nathan L. Binkert, Steven K. Reinhardt, Krisztián Flautner, Trevor N. Mudge:
PicoServer: Using 3D stacking technology to build energy efficient servers.
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- Yuchun Ma, Yongxiang Liu, Eren Kursun, Glenn Reinman, Jason Cong:
Investigating the effects of fine-grain three-dimensional integration on microarchitecture design.
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- Yong Zhan, Sachin S. Sapatnekar:
Automated module assignment in stacked-Vdd designs for high-efficiency power delivery.
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- Cesare Ferri, Sherief Reda, R. Iris Bahar:
Parametric yield management for 3D ICs: Models and strategies for improvement.
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- Nobuaki Miyakawa, Eiri Hashimoto, Takanori Maebashi, Natsuo Nakamura, Yutaka Sacho, Shigeto Nakayama, Shinjiro Toyoda:
Multilayer stacking technology using wafer-to-wafer stacked method.
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Copyright © Sun May 17 00:09:20 2009
by Michael Ley (ley@uni-trier.de)