2008 |
4 | EE | Ruchir Puri,
Devadas Varma,
Darvin Edwards,
Alan J. Weger,
Paul Franzon,
Andrew Yang,
Stephen V. Kosonocky:
Keeping hot chips cool: are IC thermal problems hot air?
DAC 2008: 634-635 |
3 | EE | Yuan Xie,
Jason Cong,
Paul Franzon:
Editorial: Special issue on 3D integrated circuits and microarchitectures.
JETC 4(4): (2008) |
2007 |
2 | EE | Ullas Pazhayaveetil,
Dhruba Chandra,
Paul Franzon:
Flexible Low Power Probability Density Estimation Unit For Speech Recognition.
ISCAS 2007: 1117-1120 |
2005 |
1 | EE | Paul Franzon,
David Nackashi,
Christian Amsinck,
Neil DiSpigna,
Sachin Sonkusale:
Molecular Electronics - Devices and Circuits Technology.
VLSI-SoC 2005: 1-10 |