| 2008 |
|---|
| 12 | EE | Jae-Seok Yang,
Andrew R. Neureuther:
Crosstalk Noise Variation Assessment and Analysis for the Worst Process Corner.
ISQED 2008: 352-356 |
| 2004 |
|---|
| 11 | EE | Frank Gennari,
Andrew R. Neureuther:
A Pattern Matching System for Linking TCAD and EDA.
ISQED 2004: 165-170 |
| 1995 |
|---|
| 10 | EE | Alfred Kwok Kit Wong,
Roberto Guerrieri,
Andrew R. Neureuther:
Massively parallel electromagnetic simulation for photolithographic applications.
IEEE Trans. on CAD of Integrated Circuits and Systems 14(10): 1231-1240 (1995) |
| 1994 |
|---|
| 9 | EE | Edward W. Scheckler,
Andrew R. Neureuther:
Models and algorithms for three-dimensional topography simulation with SAMPLE-3D.
IEEE Trans. on CAD of Integrated Circuits and Systems 13(2): 219-230 (1994) |
| 8 | EE | Kenny K. H. Toh,
Andrew R. Neureuther,
Edward W. Scheckler:
Algorithms for simulation of three-dimensional etching.
IEEE Trans. on CAD of Integrated Circuits and Systems 13(5): 616-624 (1994) |
| 1993 |
|---|
| 7 | EE | Edward W. Scheckler,
Nelson N. Tam,
Anton K. Pfau,
Andrew R. Neureuther:
An efficient volume-removal algorithm for practical three-dimensional lithography simulation with experimental verification.
IEEE Trans. on CAD of Integrated Circuits and Systems 12(9): 1345-1356 (1993) |
| 1992 |
|---|
| 6 | EE | Edward W. Scheckler,
Alexander S. Wong,
Robert K. Wang,
Goodwin R. Chin,
John R. Camagna,
Andrew R. Neureuther,
Robert W. Dutton:
A utility-based integrated system for process simulation.
IEEE Trans. on CAD of Integrated Circuits and Systems 11(7): 911-920 (1992) |
| 1991 |
|---|
| 5 | EE | Goodwin R. Chin,
Walter C. Dietrich Jr.,
Duane S. Boning,
Alexander S. Wong,
Andrew R. Neureuther,
Robert W. Dutton:
Linking TCAD to EDA - Benefits and Issues.
DAC 1991: 573-578 |
| 4 | EE | Roberto Guerrieri,
Karim H. Tadros,
John K. Gamelin,
Andrew R. Neureuther:
Massively parallel algorithms for scattering in optical lithography.
IEEE Trans. on CAD of Integrated Circuits and Systems 10(9): 1091-1100 (1991) |
| 3 | EE | Alexander S. Wong,
Andrew R. Neureuther:
The intertool profile interchange format: a technology CAD environment approach [semiconductor technology].
IEEE Trans. on CAD of Integrated Circuits and Systems 10(9): 1157-1162 (1991) |
| 1988 |
|---|
| 2 | EE | K. Lee,
Andrew R. Neureuther:
SIMPL-2: (SIMulated Profiles from the Layout-Version 2).
IEEE Trans. on CAD of Integrated Circuits and Systems 7(2): 160-167 (1988) |
| 1 | EE | Roberto Guerrieri,
Andrew R. Neureuther:
Simulation of microcrack effects in dissolution of positive resist exposed by X-ray lithography.
IEEE Trans. on CAD of Integrated Circuits and Systems 7(7): 755-764 (1988) |
