| 1994 |
|---|
| 5 | EE | Martin D. Giles,
Duane S. Boning,
Goodwin R. Chin,
Walter C. Dietrich Jr.,
Michael S. Karasick,
Mark E. Law,
Purnendu K. Mozumder,
Lee R. Nackman,
V. T. Rajan,
Duncan M. Hank Walker,
Robert H. Wang,
Alexander S. Wong:
Semiconductor wafer representation for TCAD.
IEEE Trans. on CAD of Integrated Circuits and Systems 13(1): 82-95 (1994) |
| 1992 |
|---|
| 4 | EE | Edward W. Scheckler,
Alexander S. Wong,
Robert K. Wang,
Goodwin R. Chin,
John R. Camagna,
Andrew R. Neureuther,
Robert W. Dutton:
A utility-based integrated system for process simulation.
IEEE Trans. on CAD of Integrated Circuits and Systems 11(7): 911-920 (1992) |
| 1991 |
|---|
| 3 | EE | Goodwin R. Chin,
Walter C. Dietrich Jr.,
Duane S. Boning,
Alexander S. Wong,
Andrew R. Neureuther,
Robert W. Dutton:
Linking TCAD to EDA - Benefits and Issues.
DAC 1991: 573-578 |
| 2 | EE | Duane S. Boning,
Michael L. Heytens,
Alexander S. Wong:
The intertool profile interchange format: an object-oriented approach [semiconductor technology CAD/CAM].
IEEE Trans. on CAD of Integrated Circuits and Systems 10(9): 1150-1156 (1991) |
| 1 | EE | Alexander S. Wong,
Andrew R. Neureuther:
The intertool profile interchange format: a technology CAD environment approach [semiconductor technology].
IEEE Trans. on CAD of Integrated Circuits and Systems 10(9): 1157-1162 (1991) |
