Duane S. Boning

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13EEDuane S. Boning, Karthik Balakrishnan, Hong Cai, Nigel Drego, Ali Farahanchi, Karen Gettings, Daihyun Lim, Ajay Somani, Hayden Taylor, Daniel Truque, Xiaolin Xie: Variation. ISQED 2007: 15-20
12EENigel Drego, Anantha Chandrakasan, Duane S. Boning: A Test-Structure to Efficiently Study Threshold-Voltage Variation in Large MOSFET Arrays. ISQED 2007: 281-286
11 James D. Ma, Claire Fang Fang, Rob A. Rutenbar, Xiaolin Xie, Duane S. Boning: Interval-valued statistical modeling of oxide chemical-mechanical polishing. ICCAD 2005: 141-148
10EESani R. Nassif, Duane S. Boning, Nagib Hakim: The care and feeding of your statistical static timer. ICCAD 2004: 138-139
9EEDuane S. Boning: Test Structures for Circuit Yield Assessment and Modeling. ISQED 2003: 8
8EEDuane S. Boning, Joseph Panganiban, Karen Gonzalez-Valentin, Sani R. Nassif, Chandler McDowell, Anne E. Gattiker, Frank Liu: Test structures for delay variability. Timing Issues in the Specification and Synthesis of Digital Systems 2002: 109
7EEVikas Mehrotra, Shiou Lin Sam, Duane S. Boning, Anantha Chandrakasan, Rakesh Vallishayee, Sani R. Nassif: A methodology for modeling the effects of systematic within-die interconnect and device variation on circuit performance. DAC 2000: 172-175
6 Taber H. Smith, Aaron E. Gower, Duane S. Boning: A Matrix Math Library for Java. Concurrency - Practice and Experience 9(11): 1127-1137 (1997)
5EEMartin D. Giles, Duane S. Boning, Goodwin R. Chin, Walter C. Dietrich Jr., Michael S. Karasick, Mark E. Law, Purnendu K. Mozumder, Lee R. Nackman, V. T. Rajan, Duncan M. Hank Walker, Robert H. Wang, Alexander S. Wong: Semiconductor wafer representation for TCAD. IEEE Trans. on CAD of Integrated Circuits and Systems 13(1): 82-95 (1994)
4 K. S. V. Gopalarao, Uttiya Dasgupta, Rajeev Jain, Duane S. Boning, Purnendu K. Mozumder, V. Chandramouli: An Integrated Technology CAD System for Process and Device Designers. VLSI Design 1993: 287-292
3EEK. S. V. Gopalarao, Purnendu K. Mozumder, Duane S. Boning: An integrated technology CAD system for process and device designers. IEEE Trans. VLSI Syst. 1(4): 482-490 (1993)
2EEGoodwin R. Chin, Walter C. Dietrich Jr., Duane S. Boning, Alexander S. Wong, Andrew R. Neureuther, Robert W. Dutton: Linking TCAD to EDA - Benefits and Issues. DAC 1991: 573-578
1EEDuane S. Boning, Michael L. Heytens, Alexander S. Wong: The intertool profile interchange format: an object-oriented approach [semiconductor technology CAD/CAM]. IEEE Trans. on CAD of Integrated Circuits and Systems 10(9): 1150-1156 (1991)

Coauthor Index

1Karthik Balakrishnan [13]
2Hong Cai [13]
3Anantha Chandrakasan (Anantha P. Chandrakasan) [7] [12]
4V. Chandramouli [4]
5Goodwin R. Chin [2] [5]
6Uttiya Dasgupta [4]
7Walter C. Dietrich Jr. [2] [5]
8Nigel Drego [12] [13]
9Robert W. Dutton [2]
10Claire Fang Fang [11]
11Ali Farahanchi [13]
12Anne E. Gattiker [8]
13Karen Gettings [13]
14Martin D. Giles [5]
15Karen Gonzalez-Valentin [8]
16K. S. V. Gopalarao [3] [4]
17Aaron E. Gower [6]
18Nagib Hakim [10]
19Michael L. Heytens [1]
20Rajeev Jain [4]
21Michael S. Karasick [5]
22Mark E. Law [5]
23Daihyun Lim [13]
24Frank Liu [8]
25James D. Ma [11]
26Chandler McDowell [8]
27Vikas Mehrotra [7]
28Purnendu K. Mozumder [3] [4] [5]
29Lee R. Nackman [5]
30Sani R. Nassif [7] [8] [10]
31Andrew R. Neureuther [2]
32Joseph Panganiban [8]
33V. T. Rajan [5]
34Rob A. Rutenbar [11]
35Shiou Lin Sam [7]
36Taber H. Smith [6]
37Ajay Somani [13]
38Hayden Taylor [13]
39Daniel Truque [13]
40Rakesh Vallishayee [7]
41D. M. H. Walker (Duncan M. Hank Walker) [5]
42Robert H. Wang [5]
43Alexander S. Wong [1] [2] [5]
44Xiaolin Xie [11] [13]

Colors in the list of coauthors

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)