2007 | ||
---|---|---|
13 | EE | Duane S. Boning, Karthik Balakrishnan, Hong Cai, Nigel Drego, Ali Farahanchi, Karen Gettings, Daihyun Lim, Ajay Somani, Hayden Taylor, Daniel Truque, Xiaolin Xie: Variation. ISQED 2007: 15-20 |
12 | EE | Nigel Drego, Anantha Chandrakasan, Duane S. Boning: A Test-Structure to Efficiently Study Threshold-Voltage Variation in Large MOSFET Arrays. ISQED 2007: 281-286 |
2005 | ||
11 | James D. Ma, Claire Fang Fang, Rob A. Rutenbar, Xiaolin Xie, Duane S. Boning: Interval-valued statistical modeling of oxide chemical-mechanical polishing. ICCAD 2005: 141-148 | |
2004 | ||
10 | EE | Sani R. Nassif, Duane S. Boning, Nagib Hakim: The care and feeding of your statistical static timer. ICCAD 2004: 138-139 |
2003 | ||
9 | EE | Duane S. Boning: Test Structures for Circuit Yield Assessment and Modeling. ISQED 2003: 8 |
2002 | ||
8 | EE | Duane S. Boning, Joseph Panganiban, Karen Gonzalez-Valentin, Sani R. Nassif, Chandler McDowell, Anne E. Gattiker, Frank Liu: Test structures for delay variability. Timing Issues in the Specification and Synthesis of Digital Systems 2002: 109 |
2000 | ||
7 | EE | Vikas Mehrotra, Shiou Lin Sam, Duane S. Boning, Anantha Chandrakasan, Rakesh Vallishayee, Sani R. Nassif: A methodology for modeling the effects of systematic within-die interconnect and device variation on circuit performance. DAC 2000: 172-175 |
1997 | ||
6 | Taber H. Smith, Aaron E. Gower, Duane S. Boning: A Matrix Math Library for Java. Concurrency - Practice and Experience 9(11): 1127-1137 (1997) | |
1994 | ||
5 | EE | Martin D. Giles, Duane S. Boning, Goodwin R. Chin, Walter C. Dietrich Jr., Michael S. Karasick, Mark E. Law, Purnendu K. Mozumder, Lee R. Nackman, V. T. Rajan, Duncan M. Hank Walker, Robert H. Wang, Alexander S. Wong: Semiconductor wafer representation for TCAD. IEEE Trans. on CAD of Integrated Circuits and Systems 13(1): 82-95 (1994) |
1993 | ||
4 | K. S. V. Gopalarao, Uttiya Dasgupta, Rajeev Jain, Duane S. Boning, Purnendu K. Mozumder, V. Chandramouli: An Integrated Technology CAD System for Process and Device Designers. VLSI Design 1993: 287-292 | |
3 | EE | K. S. V. Gopalarao, Purnendu K. Mozumder, Duane S. Boning: An integrated technology CAD system for process and device designers. IEEE Trans. VLSI Syst. 1(4): 482-490 (1993) |
1991 | ||
2 | EE | Goodwin R. Chin, Walter C. Dietrich Jr., Duane S. Boning, Alexander S. Wong, Andrew R. Neureuther, Robert W. Dutton: Linking TCAD to EDA - Benefits and Issues. DAC 1991: 573-578 |
1 | EE | Duane S. Boning, Michael L. Heytens, Alexander S. Wong: The intertool profile interchange format: an object-oriented approach [semiconductor technology CAD/CAM]. IEEE Trans. on CAD of Integrated Circuits and Systems 10(9): 1150-1156 (1991) |