2007 |
8 | EE | Masahiko Omura,
Toshiki Kanamoto,
Michiko Tsukamoto,
Mitsutoshi Shirota,
Takashi Nakajima,
Masayuki Terai:
A Fast Characterizing Method for Large Embedded Memory Modules on SoC.
IEICE Transactions 90-A(4): 815-822 (2007) |
2006 |
7 | EE | Toshiki Kanamoto,
Tatsuhiko Ikeda,
Akira Tsuchiya,
Hidetoshi Onodera,
Masanori Hashimoto:
Si-Substrate Modeling toward Substrate-Aware Interconnect Resistance and Inductance Extraction in SoC Design.
IEICE Transactions 89-A(12): 3560-3568 (2006) |
6 | EE | Toshiki Kanamoto,
Shigekiyo Akutsu,
Tamiyo Nakabayashi,
Takahiro Ichinomiya,
Koutaro Hachiya,
Atsushi Kurokawa,
Hiroshi Ishikawa,
Sakae Muromoto,
Hiroyuki Kobayashi,
Masanori Hashimoto:
Impact of Intrinsic Parasitic Extraction Errors on Timing and Noise Estimation.
IEICE Transactions 89-A(12): 3666-3670 (2006) |
5 | EE | Atsushi Kurokawa,
Akira Kasebe,
Toshiki Kanamoto,
Yun Yang,
Zhangcai Huang,
Yasuaki Inoue,
Hiroo Masuda:
Formula-Based Method for Capacitance Extraction of Interconnects with Dummy Fills.
IEICE Transactions 89-A(4): 847-855 (2006) |
2005 |
4 | EE | Atsushi Kurokawa,
Toshiki Kanamoto,
Tetsuya Ibe,
Akira Kasebe,
Wei Fong Chang,
Tetsuro Kage,
Yasuaki Inoue,
Hiroo Masuda:
Dummy Filling Methods for Reducing Interconnect Capacitance and Number of Fills.
ISQED 2005: 586-591 |
3 | EE | Atsushi Kurokawa,
Toshiki Kanamoto,
Akira Kasebe,
Yasuaki Inoue,
Hiroo Masuda:
A Practical Approach for Efficiently Extracting Interconnect Capacitances with Floating Dummy Fills.
IEICE Transactions 88-A(11): 3180-3187 (2005) |
2 | EE | Toshiki Kanamoto,
Tetsuya Watanabe,
Mitsutoshi Shirota,
Masayuki Terai,
Tatsuya Kunikiyo,
Kiyoshi Ishikawa,
Yoshihide Ajioka,
Yasutaka Horiba:
A Method of Precise Estimation of Physical Parameters in LSI Interconnect Structures.
IEICE Transactions 88-A(12): 3463-3470 (2005) |
1 | EE | Atsushi Kurokawa,
Toshiki Kanamoto,
Tetsuya Ibe,
Akira Kasebe,
Wei Fong Chang,
Tetsuro Kage,
Yasuaki Inoue,
Hiroo Masuda:
Efficient Dummy Filling Methods to Reduce Interconnect Capacitance and Number of Dummy Metal Fills.
IEICE Transactions 88-A(12): 3471-3478 (2005) |