| 2006 |
|---|
| 6 | EE | Atsushi Kurokawa,
Akira Kasebe,
Toshiki Kanamoto,
Yun Yang,
Zhangcai Huang,
Yasuaki Inoue,
Hiroo Masuda:
Formula-Based Method for Capacitance Extraction of Interconnects with Dummy Fills.
IEICE Transactions 89-A(4): 847-855 (2006) |
| 5 | EE | Atsushi Kurokawa,
Hiroo Masuda,
Junko Fujii,
Toshinori Inoshita,
Akira Kasebe,
Zhangcai Huang,
Yasuaki Inoue:
Determination of Interconnect Structural Parameters for Best- and Worst-Case Delays.
IEICE Transactions 89-A(4): 856-864 (2006) |
| 2005 |
|---|
| 4 | EE | Atsushi Kurokawa,
Toshiki Kanamoto,
Tetsuya Ibe,
Akira Kasebe,
Wei Fong Chang,
Tetsuro Kage,
Yasuaki Inoue,
Hiroo Masuda:
Dummy Filling Methods for Reducing Interconnect Capacitance and Number of Fills.
ISQED 2005: 586-591 |
| 3 | EE | Atsushi Kurokawa,
Toshiki Kanamoto,
Akira Kasebe,
Yasuaki Inoue,
Hiroo Masuda:
A Practical Approach for Efficiently Extracting Interconnect Capacitances with Floating Dummy Fills.
IEICE Transactions 88-A(11): 3180-3187 (2005) |
| 2 | EE | Atsushi Kurokawa,
Masanori Hashimoto,
Akira Kasebe,
Zhangcai Huang,
Yun Yang,
Yasuaki Inoue,
Ryosuke Inagaki,
Hiroo Masuda:
Second-Order Polynomial Expressions for On-Chip Interconnect Capacitance.
IEICE Transactions 88-A(12): 3453-3462 (2005) |
| 1 | EE | Atsushi Kurokawa,
Toshiki Kanamoto,
Tetsuya Ibe,
Akira Kasebe,
Wei Fong Chang,
Tetsuro Kage,
Yasuaki Inoue,
Hiroo Masuda:
Efficient Dummy Filling Methods to Reduce Interconnect Capacitance and Number of Dummy Metal Fills.
IEICE Transactions 88-A(12): 3471-3478 (2005) |
