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| 2005 | ||
|---|---|---|
| 1 | EE | A. Guédon-Gracia, E. Woirgard, C. Zardini: Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability. Microelectronics Reliability 45(9-11): 1652-1657 (2005) |
| 1 | E. Woirgard | [1] |
| 2 | C. Zardini | [1] |