J. P. Fradin

2005
3	EE	B. Khong, P. Tounsi, Ph. Dupuy, X. Chauffleur, M. Legros, A. Deram, C. Levade, G. Vanderschaeve, J. M. Dorkel, J. P. Fradin: Innovative Methodology for Predictive Reliability of Intelligent Power Devices Using Extreme Electro-thermal Fatigue. Microelectronics Reliability 45(9-11): 1717-1722 (2005)
2001
2		Felix Beaudoin, X. Chauffleur, J. P. Fradin, Philippe Perdu, Romain Desplats, D. Lewis: Modeling Thermal Laser Stimulation. Microelectronics Reliability 41(9-10): 1477-1482 (2001)
1997
1	EE	J. P. Fradin, L. Molla, B. Desaunettes: Analysis of 3D conjugate heat transfers in electronics. ED&TC 1997: 190-194

Coauthor Index

1	Felix Beaudoin	[2]
2	X. Chauffleur	[2] [3]
3	A. Deram	[3]
4	B. Desaunettes	[1]
5	Romain Desplats	[2]
6	J. M. Dorkel	[3]
7	Ph. Dupuy	[3]
8	B. Khong	[3]
9	M. Legros	[3]
10	C. Levade	[3]
11	D. Lewis	[2]
12	L. Molla	[1]
13	Philippe Perdu	[2]
14	P. Tounsi	[3]
15	G. Vanderschaeve	[3]

Colors in the list of coauthors