W. H. Li

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4EEW. H. Li, S. Q. Yang, S. C. Yang: Technique and theoretical analysis for the finishing of large discal parts. IJCAT 29(2/3/4): 168-172 (2007)
3EES. Q. Yang, W. H. Li, S. C. Yang: Numerical simulation of compulsive swirling flows field on two-phase swirling flows finishing. IJCAT 29(2/3/4): 205-207 (2007)
2EEC. F. Tsang, C. K. Chang, A. Krishnamoorthy, K. Y. Ee, Y. J. Su, H. Y. Li, W. H. Li, L. Y. Wong: A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections. Microelectronics Reliability 45(3-4): 517-525 (2005)
1EEC. F. Tsang, C. Y. Li, A. Krishnamoorthy, Y. J. Su, H. Y. Li, L. Y. Wong, W. H. Li, L. J. Tang, K. Y. Ee: Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization. Microelectronics Journal 35(9): 693-700 (2004)

Coauthor Index

1C. K. Chang [2]
2K. Y. Ee [1] [2]
3A. Krishnamoorthy [1] [2]
4C. Y. Li [1]
5H. Y. Li [1] [2]
6Y. J. Su [1] [2]
7L. J. Tang [1]
8C. F. Tsang [1] [2]
9L. Y. Wong [1] [2]
10S. C. Yang [3] [4]
11S. Q. Yang [3] [4]

Colors in the list of coauthors

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)