| 2007 |
|---|
| 4 | EE | W. H. Li,
S. Q. Yang,
S. C. Yang:
Technique and theoretical analysis for the finishing of large discal parts.
IJCAT 29(2/3/4): 168-172 (2007) |
| 3 | EE | S. Q. Yang,
W. H. Li,
S. C. Yang:
Numerical simulation of compulsive swirling flows field on two-phase swirling flows finishing.
IJCAT 29(2/3/4): 205-207 (2007) |
| 2005 |
|---|
| 2 | EE | C. F. Tsang,
C. K. Chang,
A. Krishnamoorthy,
K. Y. Ee,
Y. J. Su,
H. Y. Li,
W. H. Li,
L. Y. Wong:
A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections.
Microelectronics Reliability 45(3-4): 517-525 (2005) |
| 2004 |
|---|
| 1 | EE | C. F. Tsang,
C. Y. Li,
A. Krishnamoorthy,
Y. J. Su,
H. Y. Li,
L. Y. Wong,
W. H. Li,
L. J. Tang,
K. Y. Ee:
Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization.
Microelectronics Journal 35(9): 693-700 (2004) |
