2007 |
3 | EE | Syed M. Alam,
Chee Lip Gan,
Carl V. Thompson,
Donald E. Troxel:
Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations.
Microelectronics Journal 38(4-5): 463-473 (2007) |
2005 |
2 | EE | Syed M. Alam,
Frank L. Wei,
Chee Lip Gan,
Carl V. Thompson,
Donald E. Troxel:
Electromigration Reliability Comparison of Cu and Al Interconnects.
ISQED 2005: 303-308 |
2004 |
1 | EE | Syed M. Alam,
Chee Lip Gan,
Carl V. Thompson,
Donald E. Troxel:
Circuit Level Reliability Analysis of Cu Interconnects.
ISQED 2004: 238-243 |