| 2007 |
|---|
| 6 | EE | Syed M. Alam,
Chee Lip Gan,
Carl V. Thompson,
Donald E. Troxel:
Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations.
Microelectronics Journal 38(4-5): 463-473 (2007) |
| 2005 |
|---|
| 5 | EE | Syed M. Alam,
Donald E. Troxel,
Carl V. Thompson:
Thermal aware cell-based full-chip electromigration reliability analysis.
ACM Great Lakes Symposium on VLSI 2005: 26-31 |
| 4 | EE | Syed M. Alam,
Frank L. Wei,
Chee Lip Gan,
Carl V. Thompson,
Donald E. Troxel:
Electromigration Reliability Comparison of Cu and Al Interconnects.
ISQED 2005: 303-308 |
| 2004 |
|---|
| 3 | EE | Syed M. Alam,
Chee Lip Gan,
Carl V. Thompson,
Donald E. Troxel:
Circuit Level Reliability Analysis of Cu Interconnects.
ISQED 2004: 238-243 |
| 2002 |
|---|
| 2 | EE | Syed M. Alam,
Donald E. Troxel,
Carl V. Thompson:
A Comprehensive Layout Methodology and Layout-Specific Circuit Analyses for Three-Dimensional Integrated Circuits.
ISQED 2002: 246-251 |
| 1999 |
|---|
| 1 | EE | J. Joseph Clement,
Stefan P. Riege,
Radenko Cvijetic,
Carl V. Thompson:
Methodology for electromigration critical threshold design rule evaluation.
IEEE Trans. on CAD of Integrated Circuits and Systems 18(5): 576-581 (1999) |
