| |
| 2005 | ||
|---|---|---|
| 1 | EE | Arijit Roy, Cher Ming Tan, Rakesh Kumar, Xian Tong Chen: Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures. Microelectronics Reliability 45(9-11): 1443-1448 (2005) |
| 1 | Rakesh Kumar | [1] |
| 2 | Arijit Roy | [1] |
| 3 | Cher Ming Tan | [1] |