2005 |
9 | EE | Prashant Saxena,
Kumar N. Lalgudi,
Hans J. Greub,
Janet Meiling Wang Roveda:
A perturbation-aware noise convergence methodology for high frequency microprocessors.
ASP-DAC 2005: 717-722 |
1999 |
8 | EE | Atul Garg,
Y. L. Le Coz,
Hans J. Greub,
R. B. Iverson,
Robert F. Philhower,
Pete M. Campbell,
Cliff A. Maier,
Sam A. Steidl,
Matthew W. Ernest,
Russell P. Kraft,
Steven R. Carlough,
J. W. Perry,
Thomas W. Krawczyk Jr.,
John F. McDonald:
Accurate high-speed performance prediction for full differential current-mode logic: the effect of dielectric anisotropy.
IEEE Trans. on CAD of Integrated Circuits and Systems 18(2): 212-219 (1999) |
1998 |
7 | EE | Pete M. Campbell,
Hans J. Greub,
Atul Garg,
A. Steidl,
Steven R. Carlough,
Matthew W. Ernest,
Robert F. Philhower,
Cliff A. Maier,
Russell P. Kraft,
John F. McDonald:
A very wide bandwidth digital VCO using quadrature frequency multiplication and division implemented in AlGaAs/GaAs HBT's.
IEEE Trans. VLSI Syst. 6(1): 52-55 (1998) |
1997 |
6 | EE | C.-K. V. Tien,
K. Lewis,
Hans J. Greub,
T. Tsen,
John F. McDonald:
Design of a 32 b monolithic microprocessor based on GaAs HMESFET technology.
IEEE Trans. VLSI Syst. 5(2): 238-243 (1997) |
1995 |
5 | | A. Frisch,
Mitch Aigner,
T. Almy,
Hans J. Greub,
M. Hazra,
S. Mohr,
Nicholas J. Naclerio,
W. Russell,
M. Stebniskey:
Supplying Known-Good Die for MCM Applications Using Low-Cost Embedded Testing.
ITC 1995: 328-335 |
1994 |
4 | | Atul Garg,
T.-L. Sham,
Hans J. Greub,
James Loy,
Jack F. McDonald:
Thermal Design of an Advanced Multichip Module for a RISC Processor.
ICCD 1994: 608-611 |
1991 |
3 | | C. K. Tien,
C. C. Poon,
Hans J. Greub,
Jack F. McDonald:
F-RISC/I: Fast Reduced Instruction Set Computer with GaAs (H)MESFET Implementation.
ICCD 1991: 293-296 |
2 | | K. Nah,
Robert F. Philhower,
J. S. Van Etten,
S. Simmons,
V. Tsinker,
James Loy,
Hans J. Greub,
Jack F. McDonald:
F-RISC/G: AlGaAs/GaAs HBT Standard Cell Library.
ICCD 1991: 297-300 |
1987 |
1 | | Jack F. McDonald,
Hans J. Greub,
Randy H. Steinvorth,
Brian J. Donlan,
Albert S. Bergendahl:
Wafer Scale Interconnections for GaAs Packing - Applications to RISC Architecture.
IEEE Computer 20(4): 21-35 (1987) |