| |
| 1987 | ||
|---|---|---|
| 1 | Jack F. McDonald, Hans J. Greub, Randy H. Steinvorth, Brian J. Donlan, Albert S. Bergendahl: Wafer Scale Interconnections for GaAs Packing - Applications to RISC Architecture. IEEE Computer 20(4): 21-35 (1987) | |
| 1 | Albert S. Bergendahl | [1] |
| 2 | Hans J. Greub | [1] |
| 3 | Jack F. McDonald | [1] |
| 4 | Randy H. Steinvorth | [1] |