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J. F. J. M. Caers

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2005
1EEXiaowu Zhang, E. H. Wong, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao: Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives. Microelectronics Reliability 45(7-8): 1215-1221 (2005)

Coauthor Index

1Mahadevan K. Iyer [1]
2Ranjan Rajoo [1]
3E. H. Wong [1]
4Xiaowu Zhang [1]
5X. J. Zhao [1]

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