J. F. J. M. Caers

2005
1	EE	Xiaowu Zhang, E. H. Wong, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao: Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives. Microelectronics Reliability 45(7-8): 1215-1221 (2005)

Coauthor Index

1	Mahadevan K. Iyer	[1]
2	Ranjan Rajoo	[1]
3	E. H. Wong	[1]
4	Xiaowu Zhang	[1]
5	X. J. Zhao	[1]