| 2008 |
|---|
| 11 | EE | Zuochang Ye,
Zhenhai Zhu,
Joel R. Phillips:
Generalized Krylov recycling methods for solution of multiple related linear equation systems in electromagnetic analysis.
DAC 2008: 682-687 |
| 10 | EE | Zuochang Ye,
Dmitry Vasilyev,
Zhenhai Zhu,
Joel R. Phillips:
Sparse implicit projection (SIP) for reduction of general many-terminal networks.
ICCAD 2008: 736-743 |
| 2007 |
|---|
| 9 | EE | Zhenhai Zhu,
Joel R. Phillips:
Random sampling of moment graph: a stochastic Krylov-reduction algorithm.
DATE 2007: 1502-1507 |
| 2006 |
|---|
| 8 | EE | Luís Guerra e Silva,
Zhenhai Zhu,
Joel R. Phillips,
L. Miguel Silveira:
Variation-Aware, Library Compatible Delay Modeling Strategy.
VLSI-SoC 2006: 122-127 |
| 2005 |
|---|
| 7 | | Zhenhai Zhu,
Jacob K. White:
FastSies: a fast stochastic integral equation solver for modeling the rough surface effect.
ICCAD 2005: 675-682 |
| 6 | EE | Zhenhai Zhu,
Ben Song,
Jacob K. White:
Algorithms in FastImp: a fast and wide-band impedance extraction program for complicated 3-D geometries.
IEEE Trans. on CAD of Integrated Circuits and Systems 24(7): 981-998 (2005) |
| 2004 |
|---|
| 5 | EE | Zhenhai Zhu,
Jacob White,
Alper Demir:
A stochastic integral equation method for modeling the rough surface effect on interconnect capacitance.
ICCAD 2004: 887-891 |
| 2003 |
|---|
| 4 | EE | Zhenhai Zhu,
Ben Song,
Jacob White:
Algorithms in FastImp: a fast and wideband impedance extraction program for complicated 3-D geometries.
DAC 2003: 712-717 |
| 3 | EE | Ben Song,
Zhenhai Zhu,
John D. Rockway,
Jacob White:
A New Surface Integral Formulation For Wideband Impedance Extraction of 3-D Structures.
ICCAD 2003: 843-847 |
| 2001 |
|---|
| 2 | EE | Zhenhai Zhu,
Jingfang Huang,
Ben Song,
Jacob White:
Improving the Robustness of a Surface Integral Formulation for Wideband Impendance Extraction of 3D Structures.
ICCAD 2001: 592-597 |
| 1996 |
|---|
| 1 | EE | Wei Hong II,
Weikai Sun,
Zhenhai Zhu,
Hao Ji,
Ben Song,
Wayne Wei-Ming Dai:
A novel dimension reduction technique for the capacitance extraction of 3D VLSI interconnects.
ICCAD 1996: 381-386 |
