| 2005 |
|---|
| 5 | EE | Zhenhai Zhu,
Ben Song,
Jacob K. White:
Algorithms in FastImp: a fast and wide-band impedance extraction program for complicated 3-D geometries.
IEEE Trans. on CAD of Integrated Circuits and Systems 24(7): 981-998 (2005) |
| 2003 |
|---|
| 4 | EE | Zhenhai Zhu,
Ben Song,
Jacob White:
Algorithms in FastImp: a fast and wideband impedance extraction program for complicated 3-D geometries.
DAC 2003: 712-717 |
| 3 | EE | Ben Song,
Zhenhai Zhu,
John D. Rockway,
Jacob White:
A New Surface Integral Formulation For Wideband Impedance Extraction of 3-D Structures.
ICCAD 2003: 843-847 |
| 2001 |
|---|
| 2 | EE | Zhenhai Zhu,
Jingfang Huang,
Ben Song,
Jacob White:
Improving the Robustness of a Surface Integral Formulation for Wideband Impendance Extraction of 3D Structures.
ICCAD 2001: 592-597 |
| 1996 |
|---|
| 1 | EE | Wei Hong II,
Weikai Sun,
Zhenhai Zhu,
Hao Ji,
Ben Song,
Wayne Wei-Ming Dai:
A novel dimension reduction technique for the capacitance extraction of 3D VLSI interconnects.
ICCAD 1996: 381-386 |
