| 2003 |
|---|
| 4 | EE | Jun Wei,
F. L. Ng,
M. L. Nai,
H. Xie,
Peck Cheng Lim,
C. K. Wong:
Wafer Bonding Process Based On The Taguchi Analysis.
International Journal of Computational Engineering Science 4(2): 331-334 (2003) |
| 3 | EE | S. S. Deng,
Jun Wei,
C. M. Tan,
M. L. Nai,
W. B. Yu,
H. Xie:
Low Temperature Silicon Wafer Bonding By Sol-Gel Processing.
International Journal of Computational Engineering Science 4(3): 655-658 (2003) |
| 1997 |
|---|
| 2 | EE | Nicholas J. Belkin,
Jose Perez Carballo,
Colleen Cool,
Shin-jeng Lin,
Soyeon Park,
Soo Young Rieh,
Pamela A. Savage-Knepshield,
C. Sikora,
H. Xie,
James Allan:
Rutgers' TREC-6 Interactive Track Experience.
TREC 1997: 597-610 |
| 1996 |
|---|
| 1 | EE | Nicholas J. Belkin,
A. Cabezas,
Colleen Cool,
K. Kim,
Kwong Bor Ng,
Soyeon Park,
R. Pressman,
Soo Young Rieh,
Pamela A. Savage-Knepshield,
H. Xie:
Rutgers Interactive Track at TREC-5.
TREC 1996 |
