S. S. Deng

2003
2	EE	W. B. Yu, Jun Wei, C. M. Tan, S. S. Deng, M. L. Nai: Influence Of Applied Load On Wafer Bonding In Vacuum. International Journal of Computational Engineering Science 4(2): 351-354 (2003)
1	EE	S. S. Deng, Jun Wei, C. M. Tan, M. L. Nai, W. B. Yu, H. Xie: Low Temperature Silicon Wafer Bonding By Sol-Gel Processing. International Journal of Computational Engineering Science 4(3): 655-658 (2003)

Coauthor Index

1	M. L. Nai	[1] [2]
2	C. M. Tan	[1] [2]
3	Jun Wei	[1] [2]
4	H. Xie	[1]
5	W. B. Yu	[1] [2]