| 2003 |
|---|
| 3 | EE | Jun Wei,
F. L. Ng,
M. L. Nai,
H. Xie,
Peck Cheng Lim,
C. K. Wong:
Wafer Bonding Process Based On The Taguchi Analysis.
International Journal of Computational Engineering Science 4(2): 331-334 (2003) |
| 2 | EE | Yufeng Jin,
Jun Wei,
Peck Cheng Lim,
Zhenfeng Wang:
Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic Bonding.
International Journal of Computational Engineering Science 4(2): 335-338 (2003) |
| 1 | EE | Zhenfeng Wang,
G. J. Qi,
Jun Wei,
Peck Cheng Lim,
Yufeng Jin,
C. K. Wong:
A Novel Wafer-Level Packaging Solution For Mems.
International Journal of Computational Engineering Science 4(2): 339-342 (2003) |
