| 2006 |
|---|
| 4 | EE | C. M. Tan,
M. H. Chowdhury:
Simultaneous Analysis of Capacitive Coupling and Leakage Noise in Nanometer Scale Circuits.
APCCAS 2006: 2004-2007 |
| 2003 |
|---|
| 3 | EE | W. B. Yu,
Jun Wei,
C. M. Tan,
S. S. Deng,
M. L. Nai:
Influence Of Applied Load On Wafer Bonding In Vacuum.
International Journal of Computational Engineering Science 4(2): 351-354 (2003) |
| 2 | EE | S. S. Deng,
Jun Wei,
C. M. Tan,
M. L. Nai,
W. B. Yu,
H. Xie:
Low Temperature Silicon Wafer Bonding By Sol-Gel Processing.
International Journal of Computational Engineering Science 4(3): 655-658 (2003) |
| 2002 |
|---|
| 1 | EE | C. M. Tan,
C. P. Tan,
Weng-Fai Wong:
Shell over a Cluster (SHOC): Towards Achieving Single System Image via the Shell.
CLUSTER 2002: 28- |
