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| 2006 | ||
|---|---|---|
| 2 | EE | X. Li, Z. P. Fang, F. L. Ng, L. P. Zhao, L. Zhao: Inspection and Image Analysis of Nickel Sulphide Inclusions in Toughened Glass Panels. ICARCV 2006: 1-6 |
| 2003 | ||
| 1 | EE | Jun Wei, F. L. Ng, M. L. Nai, H. Xie, Peck Cheng Lim, C. K. Wong: Wafer Bonding Process Based On The Taguchi Analysis. International Journal of Computational Engineering Science 4(2): 331-334 (2003) |
| 1 | Z. P. Fang | [2] |
| 2 | X. Li | [2] |
| 3 | Peck Cheng Lim | [1] |
| 4 | M. L. Nai | [1] |
| 5 | Jun Wei | [1] |
| 6 | Chak-Kuen Wong (C. K. Wong) | [1] |
| 7 | H. Xie | [1] |
| 8 | L. Zhao | [2] |
| 9 | L. P. Zhao | [2] |