| 2003 |
|---|
| 3 | EE | Jun Wei,
F. L. Ng,
M. L. Nai,
H. Xie,
Peck Cheng Lim,
C. K. Wong:
Wafer Bonding Process Based On The Taguchi Analysis.
International Journal of Computational Engineering Science 4(2): 331-334 (2003) |
| 2 | EE | W. B. Yu,
Jun Wei,
C. M. Tan,
S. S. Deng,
M. L. Nai:
Influence Of Applied Load On Wafer Bonding In Vacuum.
International Journal of Computational Engineering Science 4(2): 351-354 (2003) |
| 1 | EE | S. S. Deng,
Jun Wei,
C. M. Tan,
M. L. Nai,
W. B. Yu,
H. Xie:
Low Temperature Silicon Wafer Bonding By Sol-Gel Processing.
International Journal of Computational Engineering Science 4(3): 655-658 (2003) |
