Darvin Edwards

2008
2	EE	Ruchir Puri, Devadas Varma, Darvin Edwards, Alan J. Weger, Paul Franzon, Andrew Yang, Stephen V. Kosonocky: Keeping hot chips cool: are IC thermal problems hot air? DAC 2008: 634-635
2001
1	EE	Greg Hotchkiss, Gonzalo Amador, Darvin Edwards, Paul Hundt, Les Stark, Roger Stierman, Gail Heinen: Wafer level packaging of a tape flip-chip chip scale packages. Microelectronics Reliability 41(5): 705-713 (2001)

Coauthor Index

1	Gonzalo Amador	[1]
2	Paul Franzon	[2]
3	Gail Heinen	[1]
4	Greg Hotchkiss	[1]
5	Paul Hundt	[1]
6	Stephen V. Kosonocky	[2]
7	Ruchir Puri	[2]
8	Les Stark	[1]
9	Roger Stierman	[1]
10	Devadas Varma	[2]
11	Alan J. Weger	[2]
12	Andrew Yang	[2]

Colors in the list of coauthors