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2008 | ||
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2 | EE | Ruchir Puri, Devadas Varma, Darvin Edwards, Alan J. Weger, Paul Franzon, Andrew Yang, Stephen V. Kosonocky: Keeping hot chips cool: are IC thermal problems hot air? DAC 2008: 634-635 |
2001 | ||
1 | EE | Greg Hotchkiss, Gonzalo Amador, Darvin Edwards, Paul Hundt, Les Stark, Roger Stierman, Gail Heinen: Wafer level packaging of a tape flip-chip chip scale packages. Microelectronics Reliability 41(5): 705-713 (2001) |
1 | Gonzalo Amador | [1] |
2 | Paul Franzon | [2] |
3 | Gail Heinen | [1] |
4 | Greg Hotchkiss | [1] |
5 | Paul Hundt | [1] |
6 | Stephen V. Kosonocky | [2] |
7 | Ruchir Puri | [2] |
8 | Les Stark | [1] |
9 | Roger Stierman | [1] |
10 | Devadas Varma | [2] |
11 | Alan J. Weger | [2] |
12 | Andrew Yang | [2] |