| |
| 2001 | ||
|---|---|---|
| 1 | EE | Greg Hotchkiss, Gonzalo Amador, Darvin Edwards, Paul Hundt, Les Stark, Roger Stierman, Gail Heinen: Wafer level packaging of a tape flip-chip chip scale packages. Microelectronics Reliability 41(5): 705-713 (2001) |
| 1 | Gonzalo Amador | [1] |
| 2 | Darvin Edwards | [1] |
| 3 | Gail Heinen | [1] |
| 4 | Paul Hundt | [1] |
| 5 | Les Stark | [1] |
| 6 | Roger Stierman | [1] |