| 2007 |
|---|
| 6 | EE | Yonghong Yang,
Zhenyu (Peter) Gu,
Changyun Zhu,
Robert P. Dick,
Li Shang:
ISAC: Integrated Space-and-Time-Adaptive Chip-Package Thermal Analysis.
IEEE Trans. on CAD of Integrated Circuits and Systems 26(1): 86-99 (2007) |
| 2006 |
|---|
| 5 | EE | Zhenyu (Peter) Gu,
Yonghong Yang,
Jia Wang,
Robert P. Dick,
Li Shang:
TAPHS: thermal-aware unified physical-level and high-level synthesis.
ASP-DAC 2006: 879-885 |
| 4 | EE | Yonghong Yang,
Zhenyu (Peter) Gu,
Changyun Zhu,
Li Shang,
Robert P. Dick:
Adaptive chip-package thermal analysis for synthesis and design.
DATE 2006: 844-849 |
| 3 | EE | Yonghong Yang,
Changyun Zhu,
Zhenyu (Peter) Gu,
Li Shang,
Robert P. Dick:
Adaptive multi-domain thermal modeling and analysis for integrated circuit synthesis and design.
ICCAD 2006: 575-582 |
| 2005 |
|---|
| 2 | EE | Yonghong Yang,
Z. Abid,
Wei Wang,
Z. Zhang,
C. Yang:
Efficient multi-prime RSA immune against hardware fault attack.
ISCAS (5) 2005: 4649-4652 |
| 2004 |
|---|
| 1 | | Yonghong Yang,
Zine-Eddine Abid,
Wei Wang:
An Immune CRT-Based Three-prime RSA cryptosystem.
SNPD 2004: 146-151 |
