F. Y. Chou
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2001
1
EE
W. D. Zhuang
,
P. C. Chang
, F. Y. Chou,
R. K. Shiue
: Effect of solder creep on the reliability of large area die attachment.
Microelectronics Reliability 41
(12): 2011-2021 (2001)
Coauthor
Index
1
P. C. Chang
[
1
]
2
R. K. Shiue
[
1
]
3
W. D. Zhuang
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
