| |
| 2005 | ||
|---|---|---|
| 1 | EE | Daniel T. Rooney, DeePak Nager, David Geiger, Dongkai Shanguan: Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds. Microelectronics Reliability 45(2): 379-390 (2005) |
| 1 | DeePak Nager | [1] |
| 2 | Daniel T. Rooney | [1] |
| 3 | Dongkai Shanguan | [1] |