| 2005 |
|---|
| 4 | EE | John U. Knickerbocker,
Paul S. Andry,
L. Paivikki Buchwalter,
Alina Deutsch,
Raymond R. Horton,
Keith A. Jenkins,
Young Hoon Kwark,
Gerald McVicker,
Chirag S. Patel,
Robert J. Polastre,
Christian D. Schuster,
Arun Sharma,
Sri M. Sri-Jayantha,
Christopher W. Surovic,
Cornelia K. Tsang,
Buck C. Webb,
Steven L. Wright,
Samuel R. McKnight,
Edmund J. Sprogis,
Bing Dang:
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection.
IBM Journal of Research and Development 49(4-5): 725-754 (2005) |
| 2002 |
|---|
| 3 | EE | John U. Knickerbocker,
Frank L. Pompeo,
Alice F. Tai,
Donald L. Thomas,
Roger D. Weekly,
Michael G. Nealon,
Harvey C. Hamel,
Anand Haridass,
James N. Humenik,
Richard A. Shelleman,
Srinivasa N. Reddy,
Kevin M. Prettyman,
Benjamin V. Fasano,
Sudipta K. Ray,
Thomas E. Lombardi,
Kenneth C. Marston,
Patrick A. Coico,
Peter J. Brofman,
Lewis S. (Lew) Goldmann,
David L. Edwards,
Jeffrey A. Zitz,
Sushumna Iruvanti,
Subhash L. Shinde,
Hai P. Longworth:
An advanced multichip module (MCM) for high-performance UNIX servers.
IBM Journal of Research and Development 46(6): 779-804 (2002) |
| 1992 |
|---|
| 2 | | Rao R. Tummala,
John U. Knickerbocker,
Sarah H. Knickerbocker,
L. Wynn Herron,
Robert W. Nufer,
Raj N. Master,
Mark O. Neisser,
Benedikt M. Kellner,
Charles H. Perry,
James N. Humenik,
Thomas F. Redmond:
High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution.
IBM Journal of Research and Development 36(5): 889-904 (1992) |
| 1991 |
|---|
| 1 | | John U. Knickerbocker,
George B. Leung,
William R. Miller,
Steven P. Young,
Scott A. Sands,
Richard F. Indyk:
IBM System/390 air-cooled alumina thermal conduction module.
IBM Journal of Research and Development 35(3): 330-341 (1991) |
