| 2002 |
|---|
| 3 | EE | John U. Knickerbocker,
Frank L. Pompeo,
Alice F. Tai,
Donald L. Thomas,
Roger D. Weekly,
Michael G. Nealon,
Harvey C. Hamel,
Anand Haridass,
James N. Humenik,
Richard A. Shelleman,
Srinivasa N. Reddy,
Kevin M. Prettyman,
Benjamin V. Fasano,
Sudipta K. Ray,
Thomas E. Lombardi,
Kenneth C. Marston,
Patrick A. Coico,
Peter J. Brofman,
Lewis S. (Lew) Goldmann,
David L. Edwards,
Jeffrey A. Zitz,
Sushumna Iruvanti,
Subhash L. Shinde,
Hai P. Longworth:
An advanced multichip module (MCM) for high-performance UNIX servers.
IBM Journal of Research and Development 46(6): 779-804 (2002) |
| 1992 |
|---|
| 2 | | Rao R. Tummala,
John U. Knickerbocker,
Sarah H. Knickerbocker,
L. Wynn Herron,
Robert W. Nufer,
Raj N. Master,
Mark O. Neisser,
Benedikt M. Kellner,
Charles H. Perry,
James N. Humenik,
Thomas F. Redmond:
High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution.
IBM Journal of Research and Development 36(5): 889-904 (1992) |
| 1 | | James N. Humenik,
James M. Oberschmidt,
Leon L. Wu,
Scott G. Paull:
Low-inductance decoupling capacitor for the thermal conduction modules of the IBM Enterprise System/9000 processors.
IBM Journal of Research and Development 36(5): 935-942 (1992) |
