| 1999 |
|---|
| 3 | EE | Rao R. Tummala,
Vijay K. Madisetti:
System on Chip or System on Package?
IEEE Design & Test of Computers 16(2): 48-56 (1999) |
| 1992 |
|---|
| 2 | | Rao R. Tummala,
John U. Knickerbocker,
Sarah H. Knickerbocker,
L. Wynn Herron,
Robert W. Nufer,
Raj N. Master,
Mark O. Neisser,
Benedikt M. Kellner,
Charles H. Perry,
James N. Humenik,
Thomas F. Redmond:
High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution.
IBM Journal of Research and Development 36(5): 889-904 (1992) |
| 1991 |
|---|
| 1 | | Arnold E. Barish,
James P. Eckhardt,
Mark D. Mayo,
Walter A. Svarczkopf,
Santosh P. Gaur,
Rao R. Tummala:
High Performance Packaged Electronics for the IBM ES9000TM Mainframe.
ICCD 1991: 534-539 |
