1 | EE | John U. Knickerbocker,
Paul S. Andry,
L. Paivikki Buchwalter,
Alina Deutsch,
Raymond R. Horton,
Keith A. Jenkins,
Young Hoon Kwark,
Gerald McVicker,
Chirag S. Patel,
Robert J. Polastre,
Christian D. Schuster,
Arun Sharma,
Sri M. Sri-Jayantha,
Christopher W. Surovic,
Cornelia K. Tsang,
Buck C. Webb,
Steven L. Wright,
Samuel R. McKnight,
Edmund J. Sprogis,
Bing Dang:
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection.
IBM Journal of Research and Development 49(4-5): 725-754 (2005) |