| 2008 |
|---|
| 14 | EE | Taehoon Kim,
Dongchul Kim,
Jung-A Lee,
Yungseon Eo:
Compact Models for Signal Transient and Crosstalk Noise of Coupled RLC Interconnect Lines with Ramp Inputs.
DELTA 2008: 205-209 |
| 13 | EE | Dongchul Kim,
Taehoon Kim,
Jung-A Lee,
Yungseon Eo:
Experimental Characterisations of Coupled Transmission Lines.
DELTA 2008: 262-265 |
| 12 | EE | Taehoon Kim,
Yungseon Eo:
Analytical CAD Models for the Signal Transients and Crosstalk Noise of Inductance-Effect-Prominent Multicoupled RLC Interconnect Lines.
IEEE Trans. on CAD of Integrated Circuits and Systems 27(7): 1214-1227 (2008) |
| 2007 |
|---|
| 11 | EE | Taeyong Je,
Yungseon Eo:
Efficient Signal Integrity Verification of Multi-Coupled Transmission Lines with Asynchronously Switching Non-Linear Drivers.
ISQED 2007: 245-250 |
| 10 | EE | Hyunsik Kim,
Yungseon Eo:
High-Frequency-Measurement-Based Frequency-Variant Transmission Line Characterization and Circuit Modeling for Accurate Signal Integrity Verification.
ISQED 2007: 507-512 |
| 2006 |
|---|
| 9 | EE | Seongkyun Shin,
Yungseon Eo:
Non-Physical Pseudo-Wave-Based Modal Decoupling Technique of Multi- Coupled Co-Planar Transmission Lines with Homogeneous Dielectric Media.
ISQED 2006: 278-283 |
| 8 | EE | Taeyong Je,
Yungseon Eo:
Efficient Signal Integrity Verification Method of Multi-Coupled RLC Interconnect Lines with Asynchronous Circuit Switching.
ISQED 2006: 419-424 |
| 2004 |
|---|
| 7 | EE | Seongkyun Shin,
Yungseon Eo,
William R. Eisenstadt,
Jongin Shim:
Analytical Dynamic Time Delay Model of Strongly Coupled RLC Interconnect Lines Dependent on Switching.
ISQED 2004: 337-342 |
| 6 | | Seongkyun Shin,
Yungseon Eo,
William R. Eisenstadt,
Jongin Shim:
Analytical models and algorithms for the efficient signal integrity verification of inductance-effect-prominent multicoupled VLSI circuit interconnects.
IEEE Trans. VLSI Syst. 12(4): 395-407 (2004) |
| 5 | EE | Yungseon Eo,
Seongkyun Shin,
William R. Eisenstadt,
Jongin Shim:
A decoupling technique for efficient timing analysis of VLSI interconnects with dynamic circuit switching.
IEEE Trans. on CAD of Integrated Circuits and Systems 23(9): 1321-1337 (2004) |
| 2002 |
|---|
| 4 | EE | Seongkyun Shin,
Yungseon Eo,
William R. Eisenstadt,
Jongin Shim:
Analytical signal integrity verification models for inductance-dominant multi-coupled VLSI interconnects.
SLIP 2002: 61-68 |
| 3 | EE | Yungseon Eo,
Seongkyun Shin,
William R. Eisenstadt,
Jongin Shim:
Generalized traveling-wave-based waveform approximation technique for the efficient signal integrity verification of multicoupled transmission line system.
IEEE Trans. on CAD of Integrated Circuits and Systems 21(12): 1489-1497 (2002) |
| 2 | EE | Yungseon Eo,
Jongin Shim,
William R. Eisenstadt:
A traveling-wave-based waveform approximation technique for thetiming verification of single transmission lines.
IEEE Trans. on CAD of Integrated Circuits and Systems 21(6): 723-730 (2002) |
| 2001 |
|---|
| 1 | EE | Woojin Jin,
Yungseon Eo,
William R. Eisenstadt,
Jongin Shim:
Fast and accurate quasi-three-dimensional capacitance determination of multilayer VLSI interconnects.
IEEE Trans. VLSI Syst. 9(3): 450-460 (2001) |
